Teradyne Technical Interchange Meeting (TIM)
TIM is an annual event for the Defense & Aerospace user base, which offers customers the opportunity to learn about the latest advances in Teradyne test products. The purpose of the conference is to bring fellow industry professionals together to collaborate on new test solutions and to share best practices.
TIM is going virtual for 2025!
Join us for two virtual sessions consisting of a pre-recorded paper presentation followed by live Q&A.
Session 1: Boundary Scan in ATE
May 20th, 11 AM EST
Boundary Scan interacts with UUTs in various ways, such as detecting some manufacturing defects and programming of flash memory and FPGAs. This presentation explores essential design considerations for software and hardware, and provides guidance for creating a TPS that fulfills or surpasses test requirements.
Session 2: Capturing Extremely Large Sets of Data
June 16th, 11 AM EST
This presentation will present options for developing custom HSSub Apps that support capturing and storing amounts of test data that exceeds the capacity of the memory on the test instrument.
For general inquiries, please contact: [email protected].
About TIM
The Teradyne Technical Interchange Meeting (TIM) is an annual event for the Defense & Aerospace user base, which offers customers the opportunity to learn about the latest advances in Teradyne test products. The purpose of the conference is to bring fellow industry professionals together to collaborate on new test solutions and to share best practices.
TIM Resources
Through TIM, we strive to share knowledge and to assist in making you an expert as you gain a deeper understanding of our products and services. The content presented at the seminars is intended to help you get the most out of your Teradyne test.
To stay in the know and receive notifications regarding future TIM events and updates, sign up below:
Introduction to High Speed Subsytem
Using HSSub Apps for TPS Development
Gallery of Past Events
