DesignLink: Streamlining Test Pattern Deployment with Automated Solutions | Teradyne

Design engineers generate test patterns that are typically handed off to test engineers to be incorporated into an integrated test program. As test program size, chip complexity and the number of patterns needed for complete coverage grows, the cost when these newly introduced patterns fail increases exponentially. This leads to lengthy iterations between designers and test engineers. DesignLink provides a web-portal that allows design engineers to submit patterns for testing into an automated, out of the box solution, that will compile, test and gather full execution results. This provides the test engineering team with confidence in the pattern while also tracking a full status of all the patterns for a particular device which gives team leaders a general overview of the bring up status.