The semiconductor wafer test market is trending toward higher pin count devices requiring more connections within the probe card architecture. In addition, UltraFLEXplus provides the capability for increased parallel testing for some devices. This increase in device connections directly contributes to increased probe force over larger probe array areas. Probe force management on the UltraFLEXplus platforms is addressed in multiple areas: The probe card architecture, the docking interface architecture, and the tester’s frame architecture. The UltraFLEXplus probe card architecture is structurally compatible for these high force applications. UltraFLEXplus can effectively manage many probe applications used today up to 150Kg. This paper will address new features focusing on probe force application requirements beyond 150Kg. These new features will be introduced with their respective rigidity contributions for managing high probe force applications for all devices regardless of parallelism at wafer test. This upgrade approach will increase the overall force management performance used with all the UltraFLEXplus platforms for wafer testing.